GM2121 |
RFQ for GM2121 Required Field |
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| Product | Manufacturers | Pack | D/C |
| GM2121 | - | - | - |
The gm2121 features two clock inputs. All additional clocks are internal clocks derived from one or more of these:
1. Crystal Input Clock (TCLK and XTAL). This is the input pair to an internal crystal oscillator and corresponding logic. A 20.0 MHz crystal is recommended. Other crystal frequencies may be used, but require custom programming. This is illustrated in Figure 4 below. Alternatively, a single-ended TTL/CMOS clock oscillator can be driven into the TCLK pin (leave XTAL as N/C in this case). This is illustrated in Figure 7 below. This option is selected by connecting a 10K pull-up to ROM_ADDR13 (refer to Table 17). See also Table 12.
2. Host Interface Transfer Clock (HCLK) The gm2121 TCLK oscillator circuitry is a custom designed circuit to support the use of an external
oscillator or a crystal resonator to generate a reference frequency source for the gm2121 device.
Features |
| • Zoom (from VGA) and shrink (from UXGA) scaling• Integrated 8-bit triple-channel ADC / PLL• Embedded microcontroller with parallel ROM interface• On-chip versatile OSD engine• All system clocks synthesized from a single external crystal• Programmable gamma correction (CLUT)• RealColor controls provide sRGB compliance• PWM back light intensity control• 5-Volt tolerant inputs• Low EMI and power saving features |
| PARAMETER | SYMBOL | MIN | TYP | MAX | UNITS |
| 3.3V Supply Voltages (1,2) | VVDD_3.3 | -0.3 | 3.6 | V | |
| 2.5V Supply Voltages (1.2) | VVDD_2.5 | -0.3 | 2.75 | V | |
| Input Voltage (5V tolerant inputs) (1,2) | VIN5Vtol | -0.3 | 5.5 | V | |
| Input Voltage (non 5V tolerant inputs) (1,2) | VIN | -0.3 | 3.6 | V | |
| Electrostatic Discharge | VESD | ±2.0 | kV | ||
| Latch-up | ILA | ±100 | mA | ||
| Ambient Operating Temperature | TA | 0 | 70 | ||
| Storage Temperature | TSTG | -40 | 125 | ||
| Operating Junction Temp. | TJ | 0 | 125 | ||
| Thermal Resistance (Junction to Air) Natural Convection (3) | JA | 29.4 | /W | ||
| Thermal Resistance (Junction to Case) Convection (4) | JC | 13.2 | /W | ||
| Soldering Temperature (30 sec.) | TSOL | 220 | |||
| Vapor Phase Soldering (30 sec.) | TVAP | &nb
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